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Reflowed Tin-Lead Before the widespread use of solder mask, a primary method for protecting copper circuitry was to electroplate a coating of tin or tin-lead on the copper. After component insertion, the tin plating could be liquefied with oven or vapor-phase reflow to form solderjoints. The use of solder mask over bare copper to take advantage of surface mount, wave soldering, and mixed assembly restricted the use of tin plate finishing. For simple technology product, tin or tin-lead plate and reflow remains a viable fabrication and assembly method.

For a bearing system that is properly maintained and isolated from dirt particles, the only source of failure is the fatigue effect The bearing life is usually indicated as the number of revolutions of the shaft or the number of hours of use at a standard angular speed until the first tangible sign of fatigue On the other hand, the rating life defines the number of revolutions that 90% of a common group of bearings will achieve before failing [4] The life of rolling element bearings varies inversely with approximately the third power of the radial load as follows:

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Electrolytic Nickel/Electrolytic Gold The electrolytic nickel-gold process employs galvanic electroplating. The circuit board is placed on a rack and electrically connected to a power supply (rectifier), When immersed in a solution of metal ions, the metals are reduced as a metal coating on the PCB by the supply of electrons.The metal thickness grows in a very predictable way depending on the time, current, area plated, and efficiency of the reaction. Relatively few PCBs are plated full-build with nickel-gold as the only finish. More frequently, the coating is applied selectively in combination with another finish such as OSP. For a large number of PCBs that employ edge tab connection, the PCB is electroplated in a special plating line where only the exposed edge features are immersed into the plating cell. Electroplated nickel-gold is expensive and difficult to use in high production, so it is commonly used only on features requiring high-force physical connections or gold wirebonding. Several micrometers of nickel are deposited, and 0.50 to 1.5 mm of gold protects the nickel from oxidation. Thick gold forms gold-containing phases in the solderjoint. The embrittlement of these phases has prevented the wide use of electrolytic nickel-gold as a solderable finish.

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Antitarnish and Preflux Antitarnish surface finishes are thin, organic coatings designed to prevent copper oxidation. Antitarnish chemicals include imidazole and benzotriazole. Preflux coatings are resins or rosins. These materials cannot endure long storage times and normally can be used only for single-sided soldering operations. Much of the use of simple organic coating was replaced by OSP as the cost of OSP declined, but antitarnish and preflux chemicals are still used in simple PCB fabrication.

Electroless Palladium The original concept for electroless palladium was as an alternative to the high cost of gold. Palladium shows some of the oxidation resistance similar to precious metals, and can offer a good physically strong deposit for electrical contacts and wirebonding. However, palladium is a very difficult metal to deposit electrolessly, causing substantial engineering support and yield problems. The rise in the cost of palladium metal nearly removed it from any market share worldwide. Electroless palladium reemerged in OEM testing as a possible cure for ENIG black-pad, but it is not widely used. Palladium is sensitive to the environment, so a flash

of immersion gold may be used over palladium. The coating is considered not reworkable. Palladium phases in the solderjoint pose an embrittlement hazard. 32.8.5 Electroless Gold Gold can protect copper and resist oxidation like no other metal. But electrolytic nickel-gold and ENIG both suffer from certain limitations. Electroless nickel with a coverlayer of electroless gold is intended to overcome these limitations. As with ENIG, electroless nickel underlayer is needed as a barrier layer to prevent copper to gold interdiffusion. Electroless gold can achieve a sufficient thickness to allow gold wirebonding and some physical connection functions. It also deposits much more uniform thickness than electrolytic gold. Better thickness control allows somewhat thinner coatings, so gold embrittlement can be prevented. Cost and process control considerations prevent more widespread use. In addition, all the limitations of the use of electroless nickel still apply when considering this finish.

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